P5D SEMI-AUTOMATIC SQUARE SUBSTRATE PROBE SYSTEM

PWS’ P5-D Prober System is a fully automated production handling system specifically designed to handle square substrates.  The P5-D is a member of the field-proven family of Pacific Western System’s P5 prober systems - fully automated production substrate handling systems that deliver high accuracy, high performance and high reliability probing.

The P5-D probe system comes standard with a frictionless Air Bearing Motion System (ABMS) for X-Y positioning.  The ABMS is a lead-screw driven stage that moves on a friction-free film of air - the stage is supported by air only during movement, and sits on a precision lapped surface at rest.  The ABMS is specifically designed for high precision micro stepping of semiconductor wafers and similar substrates.  The air bearing motion system, combined with PWS’ in-house manufactured lead screws, ensures superior accuracy, repeatability, and mechanical stability.

The P5-D employs an upgraded loader design to permit handling of the heavier gram loads that thick substrates present.  Substrate materials with which the P5-D excels include silicon, ceramic, and most metals and quartz.

The P5-D is also equipped with ProbeCommander, PWS’ Real Time Wafer Mapping software.  ProbeCommander, a leading edge NT-based operating environment, significantly simplifies the test and production engineer’s tasks.  For example, bin result maps from production tests can be easily re-probed for failures.  An engineer can select and move to any tested bin: the moves can be either automatic step-and-repeat or under cursor/mouse control.  If needed, unique stepping patterns can be created to step within individual dies.  

ProbeCommander includes the following features:

• Wizard-guided steps 

• Click-on-image setup navigation 

• Browse and click lot-testing startup

• Vector, serpentine, and map major and minor stepping 

• User defined, dynamically displayed colored maps and binning 

• ProbeCommander API versions enable users to customize test applications

PWS WELCOMES CUSTOM APPLICATIONS AND PROBER CONFIGURATIONS

System Features

• Cassette-to-cassette handling systems for squares

• Automatic wafer load, unload and alignment

• Support plate for mounting probes, inspection optics, and/or custom hardware

• High-performance PC control system

• Gray scale pattern recognition system

• Programmable optics light source

• Real time wafer mapping system

• X-Y Microscope Translation (optional)

• Single die alignment software (optional)

• Optical character recognition (optional)

• Temperature controlled chuck (optional)

Prober Specifications

• Stage travel:  (6.8 in. X) (10.5 in. Y)

• Theta rotation:  +/- 7.5 degrees

• Chuck planarization:  +/- 0.0005 inch

• Stage accuracy:  +/- 0.00025 inch

• Stage resolution:  0.0001 inch

• Scanning speed*:  5 inch / sec.

• Repeatability:  +/- 0.05 mils.

* Throughput, stepping or cycle time are not the same as “scanning speed”.  Stepping time varies with many factors and is highly dependent upon specific applications.  For specific data, please contact PWS engineering.